[Shanghai will build specification-level chip design and pilot platform to solve R & D problems of small and medium-sized enterprises] April 15, Tang Wenkan, deputy director of Shanghai Economic and Information Technology Commission, said at the Shanghai Automotive Core Valley Global (the first) Automotive Chip Industry Summit on April 15 that Shanghai will encourage SAIC and other vehicle enterprises to actively participate in the investment and layout of automotive chips, and support the establishment of automotive chip expert groups and industrial alliances. Gradually solve the problem of cross-industry technical communication, establish a public service platform for vehicle specification-level chip design and pilot test, and solve the problem of research and development of automotive chip small and medium-sized enterprises. At the same time, a third-party testing and certification platform for automotive chips is established in Jiading, Shanghai. Promote insurance companies to introduce commercial insurance for the loading of automotive chips and share risks in a market-oriented way. (thepaper.cn)