[gold interactive easy] optical chip + memory chip + advanced packaging, participating company subdivides the market scale of optical devices in the world the third, based on 8-layer ultra-thin chip stacking technology storage products mass production, this company has FlipChip/TSV technology first.

① optical chip + memory chip + advanced packaging, participating company subdivides the market scale of optical devices the third in the world, mass production of storage products based on 8-layer ultra-thin chip stacking technology, this company has advanced packaging capability of FlipChip/TSV technology. ② optical chip + lithography machine, substrate materials can be widely used in semiconductor laser chips, optical communication chips, the revenue of optical components for lithography has increased by more than 90%. The company cooperates with international top AI giants in the research and development of silicon optical components.