[Huicheng shares: plans to issue convertible bonds to raise no more than 1.2 billion yuan]. According to the announcement of Huicheng shares, the company intends to raise no more than 1.2 billion yuan by issuing convertible bonds to unspecified objects. after deducting the issuance cost, it will be used for the 12-inch advanced process new display driver chip wafer bump manufacturing and wafer testing expansion project, 12-inch advanced process new display driver chip chip, supplement liquidity.