[TSMC SoIC packaging business will strengthen its cooperation with OSAT manufacturers] Science and Technology Innovation Board Daily reported on the 13th that with the opening of TSMC's largest closed test center AP6 factory, the company's 3D packaging chip production capacity will be greatly increased. Supply chain sources said that TSMC has outsourced some of the processes of CoWoS and InFO packaging to semiconductor closed test foundry (OSAT) manufacturers, which has formed a mature cooperation model. TSMC has turned to Sun and Moon for help because it is better at "oS" packaging technology. (Taiwan Electronic Times)