Jiangfeng Electronics: we have mastered the production process of copper clad ceramic substrate DBC and AMB, and the related products have been initially recognized by the market.

[Jiangfeng Electronics: has mastered the copper clad ceramic substrate DBC and AMB production process related products have been initially recognized by the market] June 9, Jiangfeng Electronics acceptance agency research, said that the company through the holding subsidiary Ningbo Jiangfeng Tongxin Semiconductor Materials Co., Ltd. engaged in the third generation semiconductor chip module and high-power semiconductor module related core raw materials R & D and production Have mastered copper clad ceramic substrate DBC and AMB production process, the main products are high-end copper clad ceramic substrate. At present, the related products have been initially recognized by the market.