[news that TSMC's CoWoS capacity gap is as high as 10% to 20% of orders to Sun and Moon] according to Science and Technology Innovation Board Daily on the 6th, the industry pointed out that Nvidia and other HPC customers have strong orders, and customers have asked TSMC to expand CoWoS production capacity, resulting in tight TSMC advanced packaging CoWoS production capacity, with a gap as high as 10% to 20%. However, after considering the contribution of its own gross profit margin, TSMC chose to contract out to Sun and Moon to undertake relevant orders, driving up the surge in capacity utilization of high-grade packaging. (Taiwan Economic Daily)