[Dike Co., Ltd.: conductive silver paste for chip bonding packaging with different thermal conductivity has been in the sales stage]. Recently, Dike shares said on the interactive platform that the company is promoting and selling products for high reliability semiconductor chip packaging paste, including conductive silver paste for chip bonding packaging with different thermal conductivity. At present, related products are in the sales stage. Has gradually changed from a small customer group to a large and medium-sized customer group. On the product line, based on the continuous upgrading of semiconductor chip packaging conductive silver paste products with conventional thermal conductivity < 10W/m °K and high thermal conductivity of 10-30W/m °K, the company has launched low-temperature sintered silver paste products with ultra-high thermal conductivity > 100W °K for ultra-high thermal dissipation applications such as power semiconductor packaging, and is suitable for dispensing and printing processes, pressurized and non-pressurized processes, and other applications.