[SMIC: expected to invest a total of 22.2 billion yuan in 12-inch digital-analog hybrid integrated circuit chip manufacturing project in two to three years] SMIC announced that SMIC Pioneer signed a "settlement Agreement" with the Management Committee of Shaoxing Binhai New area to implement mass production projects on the basis of the third phase of 12-inch pilot projects. It is expected that in the next two to three years, SMIC Shaoxing Phase III 12-inch digital-analog hybrid integrated circuit chip manufacturing project with a total investment of 22.2 billion yuan and a monthly production capacity of 100000 chips will be formed. It was announced on the same day that the "Investment Agreement of SMIC Vanguard Integrated Circuit Manufacturing (Shaoxing) Co., Ltd." was signed with Xinrui Fund to invest in the construction of SMIC Shaoxing Phase III 12-inch featured process wafer manufacturing pilot line project in Shaoxing Binhai New area, mainly producing IGBT, SJ and other power chips, HVIC (BCD) and other power driver chips, with a total investment of 4.2 billion yuan. It is used to build a pilot test line that integrates R & D and monthly output of 10,000 12-inch integrated circuit characteristic wafers for small-scale engineering, domestic verification and production verification.