[Dongwei Technology: MVCP equipment for high-end semiconductors is in mass production] Dongwei Technology said on the interactive platform that the company's Msap portable VCP equipment is mainly used in high-end semiconductors. with the upgrading of chip manufacturing and packaging technology, the carrier required for first-level packaging is lighter and thinner, and the line width / pitch is at least 8 μ m / 8 μ m. For such fine circuit requirements, the current HDI process can not meet the need for a more advanced semi-addition (SAP) process or improved semi-addition (MSAP) process. For a long time, the equipment for electroplating processing of MSAP carrier plate is mainly monopolized by Japanese enterprises, Korean enterprises and Taiwan enterprises. Our MVCP equipment for high-end semiconductors is independent research and development, leading in China, has passed the customer pilot test, and signed contracts with a number of customers, is in mass production.