FAP, May 12 / PRNewswire-FirstCall-Asianet /-- in a recent institutional survey, Jiangfeng Electronics said that at present, through its holding subsidiary Ningbo Jiangfeng Tongxin Semiconductor Materials Co., Ltd., the layout of third-generation semiconductors, Ningbo Jiangfeng Tongxin specializes in the R & D and production of third-generation semiconductor chip modules and core raw materials related to high-power semiconductor modules. Have mastered copper clad ceramic substrate DBC and AMB production process, the main products are high-end copper clad ceramic substrate. The company will expand its production capacity according to the customer order demand according to the plan.