FAP, May 10 (FAP)-- people familiar with the advanced wafer-level closed testing industry revealed that it is not impossible for Samsung Electronics to produce its own mobile application processor (AP) for wafer-level fan-out packaging (FOWLP) in the fourth quarter of 2023. However, in terms of mass production maturity, yield, and cost competitiveness, Taiwan's advanced closed test supply chain is at least 2-3 years ahead, and Samsung still has a "high reference" to the leading factory packaging structure at the initial stage. (Taiwan Electronic Times)