[Secretary General of China Integrated Circuit Innovation Alliance: chips should not only focus on making up for deficiencies. The next stage should be considered to build long boards]. At the Shanghai Automotive Core Valley Core Research Global (the first) Automotive Chip Industry Summit, Ye Tianchun, Secretary General of China Integrated Circuit Innovation Alliance, said in a speech that "mending short boards" and solving the problem of "neck jam" have been the theme of China's chip industry in the past three to five years. In the next stage, we should not only focus on making up for deficiencies, but also consider the construction of long boards and the development of the comprehensive capacity of the whole industry. Ye Tianchun suggested that making automotive chips should shift from a simple individual substitution mode to a model based on domestic chips to provide solutions. In addition, the automobile chip is more of the demand traction of the application, which integrates the demand of the whole vehicle factory. (surging)